Defence Industry

Empowering Edge Intelligence: Teledyne FLIR Introduces AVP, Revolutionizing AI Processing
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Issue Net Edition | Date : 19 Apr , 2024

Teledyne FLIR, a division of Teledyne Technologies Incorporated, proudly unveils the Teledyne FLIR AVP—a cutting-edge video processor poised to revolutionize AI and computational imaging at the edge. Leveraging the pinnacle of mobile processing technology, the AVP integrates the latest Qualcomm QCS8550 chip, renowned for its prowess in mobile, automotive, and robotics systems-on-chip (SoC) technology.

This advanced processor not only packs a punch in terms of artificial intelligence (AI) performance but also boasts a compact, lightweight, and energy-efficient design. Its versatility makes it an ideal fit for seamlessly integrating thermal and visible cameras into a myriad of applications, including unmanned aerial vehicles, robotics, gimbals, handheld devices, and fixed-mounted security systems.

Powering the Teledyne FLIR Prism™ AI and ISP software libraries, the AVP interfaces flawlessly with the Boson® and Neutrino® thermal infrared imaging camera modules, as well as a wide array of popular visible cameras. Backed by extensive training on the world’s largest thermal image data lake—comprising over 5 million annotations—Prism AI emerges as a formidable perception software. It excels in detecting, classifying, and tracking targets or objects across various domains, such as automotive autonomy, automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security.

Furthermore, the Prism ISP encompasses a comprehensive suite of image processing algorithms, including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction, enhancing the overall imaging experience.

Dan Walker, Vice President of Product Management at Teledyne FLIR, asserts, “The new AVP stands as the epitome of power and efficiency in the market today, accelerating AI workloads by up to five times compared to rival offerings. With the fusion of potent edge computing and our state-of-the-art Prism digital solutions, we herald a new era of electro-optical system capabilities while simplifying development and mitigating integration risks.”

Empowering integrators to craft robust, edge-intelligent products, the AVP comes equipped with a suite of tools aimed at simplifying and streamlining development processes. Supported by the Qualcomm RB5 development kit, developers gain access to software and board-support packages, facilitating the design and fabrication of custom interface boards tailored to meet specific form, fit, function, and input-output (IO) requirements for each product.

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